Patrick Pfistner
Information
Institute: IPE
Building: 242
Room:
Phone:
Email: Patrick.Pfistner#kit.edu
Publications
Peer-reviewed journals
| [1] | H. Zhang, M. Caselle, B. Leyrer, U. Bauer, P. Pfistner, and I. Perić. Radiation hard active pixel sensor with 25μm 50μm pixel size designed for capacitive readout with RD53 ASIC. Nucl. Instrum. Meth. A, 958:162760, 2020. [ bib | DOI ] |
| [2] | P. Pfistner, T. Blank, M. Caselle, P. F. v. Wintzingerode, M. Weber, J. M. Heuser, and C. J. Schmidt. Novel high-density interconnection technology for the CBM Silicon Tracking System. JINST, 14(09):P09027, 2019. [ bib | DOI ] |
| [3] | Michael Zapf, Kai Hohlfeld, Nicole V. Ruiter, Patrick Pfistner, Koen W. A. van Dongen, Hartmut Gemmeke, Alexander Michaelis, and Sylvia E. Gebhardt. Development of single-fiber piezocomposite transducers for 3-d ultrasound computer tomography. Advanced Engineering Materials, 20(12):1800423, 2018. [ bib | DOI ] |
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Conference Proceedings
| [1] | P. Pfistner, T. Blank, R. Speck, and M. Weber. Automated assembly of large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR. PoS, 370:072, 2020. [ bib | DOI ] |
| [2] | Patrick Pfistner, Michele Caselle, Thomas Blank, and Marc Weber. Novel production method for large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR. PoS, TWEPP2018:144, 2019. [ bib | DOI ] |
| [3] | T. Blank, P. Pfistner, B. Leyrer, M. Caselle, C. Simons, C. J. Schmidt, and M. Weber. High density flex-cable and interconnection technologies for large silicon detector modules. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), pages 288--292, 2018. [ bib | DOI ] |
| [4] | Michael Zapf, K. Hohlfeld, P. Pfistner, C. Imbracio Liberman, Koen W.A. van Dongen, Hartmut Gemmeke, Nicole V. Ruiter, A. Michaelis, and S. Gebhardt. Piezofibre composite transducers for next generation 3D USCT. In Proceedings of the International Workshop on Medical Ultrasound Tomography: 1.- 3. Nov. 2017, Speyer, Germany. Hrsg.: T. Hopp, pages 323--338. KIT Scientific Publishing, 2018. 54.02.02; LK 01. [ bib | DOI ] |
| [5] | Michael Zapf, Patrick Pfistner, Claudio Imbracio Liberman, Koen van Dongen, Nico de Jong, Benjamin Leyrer, Hartmut Gemmeke, and Nicole V. Ruiter. Dice-and-fill single element octagon transducers for next generation 3D USCT. In Proceedings of the International Workshop on Medical Ultrasound Tomography: 1.- 3. Nov. 2017, Speyer, Germany. Hrsg.: T. Hopp, pages 159--177. KIT Scientific Publishing, 2017. 54.02.02; LK 01. [ bib | DOI ] |
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Conferences and Talks
Presentations
| [1] | Patrick Pfistner. Development and characterization of a novel high-density interconnection technology for the CBM Silicon Tracking System at FAIR. In 7th Matter and Technology Helmholtz Meeting, 2021. [ bib | .pdf ] |
| [2] | Patrick Pfistner. High-density interconnection technologies for the CBM Silicon Tracking System. In DPG Spring Meeting, 2019. [ bib | .pdf ] |
| [3] | Patrick Pfistner. Novel production method for large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR. In TWEPP 2018, 2018. [ bib | http ] |
| [4] | Patrick Pfistner. CBM STS detector module construction and characterization. In 4th Matter and Technology Student retreat, 2018. [ bib | .pdf ] |
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Posters
| [1] | Patrick Pfistner. Development and characterization of high-density interconnection technologies for the CBM Silicon Tracking System at FAIR. In Quark Matter 2019 - the XXVIIIth International Conference on Ultra-relativistic Nucleus-Nucleus Collisions, 2019. [ bib | http ] |
| [2] | Patrick Pfistner. Automated assembly of large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR. In TWEPP - Topical Workshop on Electronics for Particle Physics, 2019. [ bib | http ] |
| [3] | Patrick Pfistner. Module assembly technologies for the silicon tracking system of the cbm experiment at fair. In 4th Matter and Technology Helmholtz Meeting, 2018. [ bib | .pdf ] |
This file was generated by bibtex2html 1.98.